GaAs package level reliability

zaelste

一般来说， III-V器件 如果从半导体厂拿来的时候， 可靠性都是经过测量的(WAFER LEVEL RELIABILITY)， 但是变成产品， 要封装组装成MODULE， 因此，不知到大家是否知道PACKAGE LEVEL RELIABILITY 经历过哪些测试， 条件如何， 比如GAAS。III-V  和CMOS不一样，
not like TDDB, HCI which is frozen for CMOS technology.

感觉上应该和WLR 一样，

1.  比如 常见得check GaAs normal failure MODE  

a:  gate contact sinking and channel degradation HCI
b:  ohmic contact degradation at source/drain
c:  Trap level effect
+  packaged induced Hydrogen poison   

2. Is there any testkey must be put into the testchip to debug failure rootcause , interconnect,junction, contact  or others.
    Is there any testkey which can alert potential reliability issue

希望大家一起学习交流。